solder造句
- 1. Solder side is chosen to measure.
- 量测以吃锡面为选择点。
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- 2. Tin plating on Solder Tail.
- 的锡焊尾，电镀。
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- 3. Here are some solder pics.
- 以下是一些焊锡照片。
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- 4. SOLDERABILITY: Wave solder, no wash.
- 可焊性：波焊，不洗。
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- 5. Excellent in solder heat resistance.
- 焊铅锡耐热性优良。
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- 6. Surface to solder are gold and clean.
- 待焊接的表面是清洁的金面。
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- 7. Suit for reflow and wave flow solder.
- 适应再流焊与波峰焊。
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- 8. Good solder effect.
- 良好的焊锡效果。
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- 9. Remove rust, scale, paint, solder and more.
- 除锈，氧化皮，油漆，焊料等。
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- 10. An ideal connection that puts any solder to shame.
- 这种理想的连结方式，让其它各类接合方式瞠乎其后。
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- 11. The third step, the cable soldered to the solder hole.
- 第三步，把电缆焊接到焊接孔上。
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- 12. Discuss technology principle of controlling solder oxide.
- 论述了其抑制钎料氧化技术机理。
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- 13. The solder pad pinch of the device also decreasing rapidly.
- 焊球尺寸的减小导致了焊球强度也随之降低。
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- 14. Is the storage fridge temperature of Solder Paste controlled?
- 是否对存放焊膏的电冰箱温度进行控制？
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- 15. When the solder flows, remove the iron and let the area cool.
- 当锡焊料开始流动，移开电烙铁，使该位置降温冷却。
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- 16. Solder the power wires, positive and negative battery contacts.
- 焊锡线的力量，积极和消极的电池接触。
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- 17. Now we can use temporary solder mask to solve all the problems.
- 现在，我们可以用临时阻焊膜来解决这一问题。
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- 18. Carefully solder 2 new thin, flexible, insulated wires in place.
- 小心的将两条细、易弯曲并且绝缘的新导线焊接到位。
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- 19. Discasses the way of the solder work structure design and notes.
- 讨论焊接件结构的设计方法及注意事项。
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- 20. Remove the solder so that there is no contact between the diodes.
- 除去焊锡，使得两个二极管不接触。
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- 21. I chose to place, and solder, a lot of the components all at once.
- 我选择的地方，和焊料，在一次所有组件很多。
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- 22. Therefore, it is necessary to study the reliability of this mixed solder joint.
- 因此，有必要对这种混合焊点进行可靠性分析。
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- 23. Use only with production equipment specifically designed for use with solder paste.
- 于专为锡膏设计的设备中使用。
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- 24. So study lead-free solder paste in the electronic application package is important.
- 因此研究无铅锡膏在电子封装中的应用具有重要意义。
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- 25. We will mill, cut, mold solder, program, and draw our way to evaluating product design.
- 我们将使用磨、切割、焊接铸模、设计程式且推断出自己一套衡量产品设计的方法。
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- 26. We will mill, cut, mold solder, program, and draw our way to evaluating product design.
- 我们将使用磨、切割、焊接铸模、设计程式且推断出自己一套衡量产品设计的方法。
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